Texas Instruments (TI) announced plans to start construction next year on its new 300-millimeter semiconductor wafer fabrication plants in Sherman, Texas.
The North Texas site has the potential for up to four fabs to meet demand over time. Construction of the first and second fabs is set to begin in 2022.
“TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage,” said Rich Templeton, TI’s chairman, president and CEO.
Production from the first new fab is expected as early as 2025. TI has the option to include up to four fabs. Total investment potential at the site could reach approximately $30 billion and support 3,000 direct jobs over time, TI said.
The new fabs will complement TI’s existing 300-mm fabs which include DMOS6 (Dallas, Texas), RFAB1 and the soon-to-be-completed RFAB2 (both in Richardson, Texas), which is expected to start production in the second half of 2022. Additionally, LFAB (Lehi, Utah), which TI recently acquired, is expected to begin production in early 2023.
