Qualcomm Technologies, the leading chipset supplier, has made several announcements at the 2023 Mobile World Congress (MWC) in Barcelona.
Snapdragon Satellite
Qualcomm Technologies announced its collaboration with Honor, Motorola, Nothing, OPPO, Vivo and Xiaomi to develop smartphones with satellite communication capabilities leveraging the Snapdragon Satellite.
Snapdragon Satellite is the worlds first satellite-based two-way capable messaging solution for smartphones. Snapdragon Satellite will be available across all upcoming 5G Modem-RF systems and Snapdragon Mobile Platform tiers (from 8- to 4- tier) as the ecosystem matures.
Beyond smartphones, Snapdragon Satellite is set to expand to other device categories in compute, automotive and IoT segments.
5G Carrier Aggregation with 5CC trial
Nokia, Qualcomm Technologies, and T-Mobile announced they have achieved a worlds first showcase of aggregating 5G Standalone (5G SA) spectrum using 5 Components Carrier (5CC) aggregation in sub-6 GHz spectrum. The trial aggregated 2 FDD and 3 TDD carriers resulting in peak downlink throughput speeds exceeding 4.2Gbps. 5G Carrier Aggregation with 5CC allows mobile operators to deliver higher data rates, more reliable connections and better coverage to even more customers.
The 5CC CA call was conducted on Nokias AirScale base station and a mobile test device powered by the new Snapdragon X75 5G Modem-RF System, the worlds first modem-RF solution to support 5G 5x carrier aggregation.
During the test five component carriers on FDD bands n71 (600MHz) and n25 (1900MHz) and TDD bands n41 (2.5GHz) and n77 (3.7GHz) were aggregated. The uplink data rates were accelerated with 5G uplink Carrier Aggregation on bands n25 and n77.
Snapdragon X75
Qualcomm Technologies announced the Snapdragon X75, X72, and X35 5G M.2 and LGA Reference Designs.
Customer sampling of the Snapdragon X75, X72, and X35 5G M.2 and LGA Reference Designs are currently underway, and the solutions are expected to be commercially available starting the second half of 2023.
Qualcomm X100 5G RAN Accelerator Card
Qualcomm Technologies plans to collaborate with Dell Technologies to develop a 5G vDU, integrating the Qualcomm X100 5G RAN Accelerator Card into Dell PowerEdge servers in order to proliferate Open RAN deployments. Qualcomm and Dell plan to simplify deployments and lower total cost of ownership by delivering O-RAN compliant, energy-efficient, virtualized, cloud-native 5G solutions.
Mavenir
Mavenir and Qualcomm announced the launch of its next generation OpenBeam massive MIMO (mMIMO) 32TRX Active Antenna Unit (AAU), featuring the Qualcomm QRU100 5G RAN Platform.
Schneider Electric
Schneider Electric, Capgemini, and Qualcomm announced their collaboration on a first-of-its-kind 5G-enabled automated hoisting solution. The companies have joined efforts on design and installation of the solution at Schneider Electrics hoisting lab in Grenoble, France.
NEC
Qualcomm and NEC highlighted their commitment to push the commercialization of next-generation networks with the introduction of the latest 5G vDU from NEC. Powered by the Qualcomm X100 5G RAN Accelerator Card, HPE ProLiant DL110 Platform, and Red Hat Enterprise Linux, this innovative infrastructure solution aims to address capacity challenges and low latency needs of networks of the future.
Viettel
Viettel and Qualcomm have completed the first versions of Viettels 5G Distributed Unit (DU) and Radio Unit (RU) based on the Qualcomm X100 5G RAN Accelerator Card and Qualcomm QRU100 5G RAN Platform, respectively.
Snapdragon Digital Chassis
Qualcomm announced the addition to its Snapdragon Digital Chassis connected car technology portfolio with its Snapdragon Auto 5G Modem-RF Gen 2.
