MediaTek will be unveiling 6G-enabling technologies, including hybrid computing, a live LEO broadband NR-NTN trial, and sub-band full duplex (SBFD) — at the Mobile World Congress (MWC) 2025.
MediaTek, which competes with Qualcomm, is also showcasing its latest M90 5G Advanced modem, along with innovations in Dimensity Auto and Dimensity Smartphone SoCs.
MediaTek-powered devices from top global brands will be on display. Joe Chen, President of MediaTek, said visitors at the MWC 2025 can explore 6G-era technologies, generative AI hybrid computing, and 5G-Advanced solutions at the event.
6G
MediaTek is showcasing Hybrid Computing, a key component for 6G standardization. It combines device cloud + RAN as an edge cloud to enable low-latency applications like Generative AI, carrier-grade privacy, and dynamic resource scheduling. The demos are in collaboration with NVIDIA, Intel, and G REIGNS.
RFFE System
MediaTek’s Envelope Assisted RFFE System improves power amplifier efficiency by 25 percent, reduces device heating, and expands addressable bandwidth by over 100MHz, enabling wider coverage without increasing power consumption.
Sub-Band Full Duplex for 6G
Sub-Band Full Duplex (SBFD) improves spectrum efficiency by boosting uplink coverage and reducing latency. MediaTek, in collaboration with Keysight, has demonstrated self-interference mitigation for small devices like smartphones.
MediaTek M90 5G Advanced Modem
The M90 5G-Advanced modem supports speeds up to 12Gbps, simultaneous FR1+FR2 connectivity, and AI-powered Smart Antenna technology. It reduces power consumption by 18 percent compared to previous models and achieved 10Gbps throughput in live network trials with Ericsson.
Smart AI Antenna
The Smart AI Antenna detects body proximity and network environment without external sensors. It dynamically adjusts antenna tuning and uplink power to maintain signal quality, demonstrated in partnership with Anritsu.
Intelligent CPE: Generative AI Gateway
MediaTek’s Generative AI Gateway brings AI capabilities to all connected devices, not just smartphones. It enhances device functionality while ensuring privacy. The Gateway also boosts uplink performance by 1.9x and reduces network latency by 20x with L4S technology.
Next Generation Satellite Connectivity (NTN)
MediaTek is demonstrating Ku-band NR-NTN satellite connectivity, which enables ubiquitous broadband for 5G devices. Recent trials with OneWeb LEO satellites and partners like Eutelsat, AIRBUS, and Sharp have proven the technology’s effectiveness.
MediaTek Dimensity Auto
The Dimensity Auto platform offers multimedia, 3D graphics, and AI capabilities across multiple virtual machines. It features an 8K eCockpit display, developed with strategic partners for next-gen in-vehicle experiences.
MediaTek Dimensity 9400
The Dimensity 9400 chip powers smartphones with advanced Generative AI features like AI Audio Focus, AI Telephoto, and ray-traced graphics. It enhances photography, videography, and gaming experiences.
224G SerDes for ASIC
MediaTek’s 224G SerDes provides high-performance, reliable connectivity for AI, data centers, and networking. It uses advanced process nodes and chip-to-chip interconnects to deliver efficient, high-bandwidth solutions for ASIC customers.
TelecomLead.com News Desk
