UK-based Arm Ltd has launched new chip technology — Arm Total Compute Solutions 2023 (TCS23) — for device and chipset customers.
Chip maker MediaTek will be using TCS23 for making its next-generation smartphone chips Dimensity 9200 targeting its OEM customers.
MediaTek, in Arm’s blog blog, said the chips will help improve the performance of its next-generation smartphones.
Arm is launching Immortalis-G720, a chip for video image processing and AI applications, and the Cortex-X4, a processor that would be the brains of the mobile device at Taiwan’s Computex conference.
Arm said both new chips have 15 percent better performance than their previous generations, and the Cortex-X4 uses 40 percent less power, key for smartphones that need to keep battery use time long.
Arm also said it has “taped out” the Cortex-X4 at Taiwan Semiconductor Manufacturing (TSMC), which means it had a chip manufactured at the factory, an expensive process usually done by chip designers that sell the final chip.
Financial Times reported last month that Arm was developing its own chip to showcase the capabilities of its designs. Arm said the Cortex-X4 was taped out on TSMC’s N3E process and said it was an industry first.
“Mobile Gaming has increasingly become the world’s preferred form of gaming, and the smartphone is now the most popular way to game, with users demanding ever more performance and features to improve their gaming experience,” Bryan Chang, General Manager, ASUS Phone Business Unit, said.
“Together with the developer community, Android is committed to bringing the power of computing to as many people as possible. We’re excited to see how Arm’s new hardware advancements are adopted by vendors, with security and performance improvements that can benefit the Android ecosystem as a whole,” Dave Burke, VP of Engineering, Android, said.
“With 70 percent of vulnerabilities being due to memory bugs, close collaboration with Arm on MTE will define the direction for the industry, help ensure customer trust and deliver amazing mobile experiences,” Samul Deng, President of Research & Development Mgmt Dept, HONOR, said.
“The combination of Intel 18A technology with Arm’s newest and most powerful CPU core, the Cortex-X4, will create opportunities for companies looking to design the next generation of innovative mobile SoCs,” Stuart Pann, Senior Vice President and General Manager, Intel Foundry Services (IFS).
“Arm’s 2023 IP, the Cortex-X4 and Cortex-A720, and Immortalis G720 have provided an excellent foundation for our next-generation Dimensity flagship 5G smartphone chip, which will deliver impressive performance and efficiency through groundbreaking chip architecture and technical innovations,” JC Hsu, Corporate Senior Vice President and General Manager of Wireless Communications Business Unit, MediaTek, said.
“Using their latest and greatest CPU and GPU IP guarantees the smooth multitasking of apps and flow needed to successfully empower new multi-screen use cases and with support from the wider Arm ecosystem we will continue to create more fantastic mobile smartphones on Arm’s latest IP,” Henry Duan, Vice President, President of Smartphones Product, OPPO, said.
“Arm has been an invaluable partner in delivering new levels of mobile performance and efficiency, enabled through their latest architectures like Armv9.2,” Seogjun Lee, Executive Vice President of Application Processor (AP) Development, Samsung Electronics, said.
“Tencent Games and Arm have a solid long-term partnership. Every time Arm introduces new products to the mobile gaming ecosystem, it means players around the world will enjoy the next generation of computing power, and is also a precious opportunity for us to take the mobile gaming experience to a whole new level,” Congbing Li, Vice General Manager of CROS, Tencent Games, said.
“Our latest collaboration with Arm is an excellent showcase of how we can enable our customers to reach new levels of performance and efficiency with TSMC’s most advanced process technology and the powerful Armv9 architecture,” Dan Kochpatcharin, Head of the Design Infrastructure Management Division, TSMC, said.
“Arm and Unity are committed to working together to ensure developers can unlock their potential on Arm devices. Our work on Adaptive Performance demonstrates the impact today, and for the future, by enabling developers to optimize their user experience over a broader range of devices,” Nick Rapp, Senior Director, Platform, Unity, said.
“Vivo will continue to work with Arm to drive the technology breakthrough in intelligent products, enabling broader global users to enjoy the digital world with outstanding performance,” Yujian Shi, Senior Vice President & CTO, vivo, said.
“Xiaomi provides the best-in-class experience to our users powered by leading-industry platform capabilities. Through close collaboration with Arm and chipset partners, smartphones across all price segments are equipped with the ideal CPUs and GPUs to meet their ultimate needs,” Xuezhong Zeng, Senior Vice President, Xiaomi Group, said.
