Today’s telecom news includes announcements on Vodafone Idea, Aditya Birla Group, Huawei, ZTE, among others.
Vodafone Idea Commits Rs 490 Billion to Spectrum Repayments Over Three Years
Vodafone Idea has committed to repaying nearly Rs 490 billion in spectrum dues over the next three years, addressing the company’s largest remaining financial overhang after the government reduced its adjusted gross revenue liabilities. The commitment was outlined at Vi’s 31st annual general meeting, where Aditya Birla Group chairman said the company’s business plan accounts for all scheduled spectrum payments. AGR payments have been deferred to financial year 2034-35, while outstanding bank loans were cited at Rs 2.25 billion. The spectrum repayment plan is important as Vi seeks to rebuild lender confidence and advance fundraising and network investment. The operator’s ability to meet these obligations will remain linked to cash generation, fundraising capacity and continued 4G and 5G expansion.
India Assesses Cost of Replacing Legacy Huawei and ZTE Telecom Gear
India is evaluating a “rip and replace” programme for legacy Chinese telecom equipment supplied by Huawei and ZTE, with the government seeking information from operators to assess network exposure and replacement costs. The exercise is being conducted for the Ministry of Home Affairs, with the Department of Telecommunications gathering details from operators. Huawei and ZTE are not approved trusted-source vendors for new 5G deployments, but older equipment remains in parts of 4G and fixed-line networks installed before the trusted-source regime. A replacement programme could create capital expenditure for operators, with industry estimates putting the potential cost of removing Chinese hardware and software from Bharti Airtel and Vodafone Idea networks at up to $3 billion. The government is assessing costs.
India Unveils Rs 1.27 Lakh Crore Semicon 2.0 Push for Chip Ecosystem
India has notified the Semicon 2.0 programme with an outlay of Rs 1.27 lakh crore, expanding government support across the semiconductor value chain. The scheme covers six areas: chip design, semiconductor capital equipment, fabrication units, assembly, packaging and testing, alongside ecosystem development. Electronics and IT Minister Ashwini Vaishnaw also announced a high-level expert panel to identify strategically important semiconductor products eligible for incentives. The panel will be jointly chaired by the Principal Scientific Adviser and National Security Adviser, linking semiconductor policy with national strategic priorities. The programme is intended to deepen domestic capabilities beyond fabrication and encourage a design-to-manufacturing ecosystem as India seeks greater resilience in critical technology supply chains and stronger participation in the global chip industry.
SHAFANA FAZAL
