Beijing Nufront selects Arteris FlexNoC interconnect IP and C2C for mobile phone systems on chip

By Telecom Lead Team: Arteris, a provider of
network-on-chip (NoC) interconnect IP solutions, announced that its FlexNoC
interconnect IP has been licensed by Beijing Nufront, a systems and silicon
provider in China.

 

Nufront chose Arteris’ network on chip interconnect IP
after evaluating many other technologies. The selection tends to address the
low power and high performance needs of its mobile phone systems on chip (SoC).

 

“Nufront is pushing the technical envelope to
deliver the best mobile phone battery life while delivering maximum
performance. Arteris FlexNoC interconnect IP will simultaneously lower our
SoCs’ power consumption and increase our performance and frequency,” said Rock
Yang, vice president of marketing at Nufront.

 

Nufront has also chosen the C2C Chip-to-Chip Link IP to
allow low latency connections between SoCs.

 

“Nufront’s selection of Arteris FlexNoC for such a
critical part of their rapidly growing business shows the confidence SoC makers
have in Arteris network on chip technology. Arteris’ network-on-chip
interconnect IP is a key enabler to creating modern mobile phone SoCs,”
said K. Charles Janac, president and CEO of Arteris.

 

Arteris network-on-chip interconnect IP offers the
ability to reduce the number of interconnect wires and logic required for SoC
design. Reducing the interconnect wires and logic gates resolves routing
congestion and timing closure issues at the back-end place-and-route stage,
resulting in shorter development cycle time, faster SoC frequencies, smaller
SoC area and less SoC power.

 

Arteris recently announced that its C2C Chip-to-Chip Link IP has been selected
by Spreadtrum Communications, a fabless semiconductor provider in China for
inter-chip communication between its mobile phone baseband chips and
application processors.

 

C2C allows Spreadtrum to remove a dedicated memory module
from its mobile phone reference design, reducing customers’ design cost.

 

editor@telecomlead.com

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