announced that its TD-LTE chipset, integrated in a USB dongle developed by
AsiaTelco Technologies, achieved download speeds of more than 50Mbps and upload
speeds of more than 18Mbps in a live over-the-air demonstration requested by
executives from China Mobile.
As part of the executive
demonstration, Altair’s chipset provided high speed broadband internet service for
meeting participants.
Altair
which is shipping one of the first commercial TDD/FDD LTE chipsets in the
market has established a strong leadership position in the emerging TD-LTE
market.
The company’s chipset
has already demonstrated the highest performance of any other TD-LTE solution
in India and Japan, and prior to last week’s demo at the NGMN meeting, has
completed several months of rigorous testing with China Mobile.
The combination of
AsiaTelco’s strong product integration expertise and our field proven TD-LTE
chipsets has allowed us to bring one of the first commercial grade TD-LTE
solutions to market,” said Eran Eshed, co-founder and VP of Marketing and
Business Development at Altair Semiconductor.
“Our customers not
only benefit from a very mature and field proven TD-LTE solution, they also get
to use the exact same chipset and software platform to serve FDD LTE markets –
and in any LTE frequency band globally. This is an extremely valuable
proposition which provides us with tremendous market traction,” Eshed
added.
“AsiaTelco is very
grateful to China Mobile for providing us with the opportunity to demonstrate
our first TD-LTE product,” said Jason Ding, CEO of AsiaTelco Technologies
Co.
“Our partnership
with Altair has provided us with the ability to offer LTE products to the
market well ahead of our competition and we will continue to expand our LTE
product portfolio based on Altair technology, as well as introduce additional
products to our carrier customers this year,” Ding added.
By TelecomLead.com Team
editor@telecomlead.com
