Telecom network vendor Huawei has joined hands with imec to conduct joint research on optimizing bandwidth density, power consumption, thermal robustness and cost.
As part of the agreement, Huawei will work with imec’s R&D team in Leuven, Belgium, for achieving technological progress to deliver connectivity matching the future needs of Europe.
In 2013, Huawei, a Chinese telecom network supplier, acquired photonics company Caliopa, a spin-off from imec and UGent, adding silicon photonics research to its European R&D operations.
“Having acquired expertise in the field of silicon photonics thanks to our acquisition of Caliopa last year, this partnership with imec is the logical next move towards next-generation optical communication for businesses and consumers in Europe and beyond,” said Hudson Liu, CEO, Huawei Belgium.
Thanks to Huawei’s global platform and network, the company can bring silicon photonics research results to the market, speeding up the commercialization of its products.
Recently, Huawei announced the purchase of Internet of Things pioneering company Neul in the UK, the launch of an innovation centre in Walldorf, Germany, and the opening of an R&D site in Sophia Antipolis, France.
editor@telecomlead.com
