TSMC raised $3.5 bn in bonds for new plant in U.S

Taiwanese chip firm TSMC has raised $3.5 billion in bonds for its new plant in the U.S. state of Arizona, according to a term sheet.
Taiwan Semiconductor Manufacturing, a major Apple supplier and the world’s largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory.