MediaTek has introduced the Dimensity 7300 and the Dimensity 7300X targeting gaming and AI smartphone makers.
MediaTek’s Dimensity 7300 chipsets enable multitasking, superior photography, accelerated gaming, and AI-enhanced computing. MediaTek did not reveal the AI capabilities of its chipsets.
MediaTek’s Dimensity 7300X is designed for flip-style foldable devices, providing support for dual displays.
Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25 percent lower power consumption in the A78 cores compared to the Dimensity 7050.
The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences.
MediaTek’s Dimensity 7300 series offers 20 percent faster FPS and 20 percent improved energy efficiency. The chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
MediaTek’s Dimensity 7300 chipsets offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can record 4K HDR video with over 50 percent wider dynamic range compared to competitor solutions, bringing out more details in videos.
MediaTek APU 655 boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips accommodate new mixed precision data types to efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.
