TrendForce’s latest insights into the High Bandwidth Memory (HBM) market reveal NVIDIA’s strategic move to diversify its HBM suppliers for bolstering supply chain resilience and efficiency.
The spotlight is on the anticipated completion of Samsung’s HBM3 (24GB) verification with NVIDIA by December this year. Notably, Micron, SK hynix, and Samsung have made progress in providing their HBM3e samples to NVIDIA, setting the stage for a significant industry shift.
The complexity of the HBM verification process, estimated at two quarters, prompts expectations that preliminary HBM3e results may surface by the end of 2023. However, comprehensive evaluations are projected to conclude by 1Q24, influencing NVIDIA’s procurement decisions for 2024.
NVIDIA’s dominance in the high-end chip market persists, with plans to expand its portfolio of advanced AI chips. The company’s 2024 roadmap includes the introduction of the H200, employing 6 HBM3e chips, and the B100, utilizing 8 HBM3e chips. Additionally, NVIDIA aims to integrate its Arm-based CPUs and GPUs to launch the GH200 and GB200, augmenting its lineup with specialized and potent AI solutions.
Contrastingly, AMD’s 2024 focus centers on the MI300 series with HBM3, transitioning to HBM3e for the next-gen MI350, expected to commence verification in 2H24, with significant product scaling projected for 1Q25.
Intel Habana’s strategic moves entail the Gaudi 3, slated for mid-2024, which is expected to maintain HBM2e but upgrade to 8 stacks, reflecting the company’s commitment to advancing AI solutions.
HBM4, slated for a 2026 launch, is projected to introduce tailored specifications and performance enhancements for future NVIDIA products and other Chipset Solution Providers (CSPs). The move towards higher computational performance prompts the evolution from 12-layer (12hi) to 16-layer (16hi) stacks, driving demand for innovative hybrid bonding techniques.
Notably, a significant paradigm shift is underway, marking a transition from standardized commodity DRAM to customized HBM4 specifications. Buyers are exploring unique layouts like stacking HBM directly atop the System-on-Chip (SoC), indicating a shift towards tailored HBM technology applications.
TrendForce anticipates a notable departure from traditional frameworks in the HBM industry, signaling an era of specialized production driven by customization demands, paving the way for innovative design and pricing strategies. This shift reflects the evolving landscape of high-speed memory technology, showcasing the industry’s readiness for a more specialized, bespoke approach to HBM innovation.
