Intel secures $3 bn under CHIPS and Science Act for secure enclave program

United States said Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act to spearhead the Secure Enclave program, aimed at bolstering the trusted manufacturing of advanced semiconductors for the U.S. government. This initiative underscores Intel’s critical role in securing the domestic chip supply chain, in collaboration with the Department of Defense (DoD).

Intel technology for 5G

Building on past collaborations such as Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) and the State-of-the-Art Heterogeneous Integration Prototype (SHIP), the Secure Enclave program further strengthens U.S. technological infrastructure.

Intel, as the only American company that designs and manufactures leading-edge logic chips, will work with the DoD to enhance national security by developing cutting-edge solutions.

“Today’s announcement highlights our joint commitment with the U.S. government to fortify the domestic semiconductor supply chain and to ensure the United States maintains its leadership in advanced manufacturing, microelectronics systems, and process technology,” Intel President Chris George said.

The program is distinct from Intel’s earlier funding agreement with the Biden-Harris Administration, which focuses on expanding commercial fabrication facilities. This new award is part of the U.S. strategy to strengthen its technological capabilities through domestic manufacturing, further enhanced by Intel Foundry’s advanced technology, Intel 18A, set for production in 2025.

Intel has a long history of working with the DoD, contributing to pivotal programs like SHIP and RAMP-C, and successfully delivering multi-chip prototypes and developing defense industrial base (DIB) products. These efforts aim to modernize and enhance the U.S. defense infrastructure, keeping America at the forefront of microelectronics technology.

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