RANOVUS, a provider of next generation interconnects for the telecommunications and information technology industries, has closed an $11 million round of financing to deliver innovative interconnect solutions.
The investment enables the delivery of a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity, RANOVU said.
RANOVU technology delivers significant reduction in power dissipation, size and cost of interconnects, and enables a much lower latency compared to traditional solutions.
“We started RANOVUS with a world-class team of technologists and marketers to address the ever increasing challenge of cost-effectively scaling Data Center networks,” said Hamid Arabzadeh, RANOVUS’ Chairman, president and CEO.
According to Arabzadeh, the platform technology enables data center operators to achieve cost-effective, power efficient and low latency connectivity from 100Gb/s to multi Tb/s.
The funding partners include Azure Capital Partners, T-Venture, BDC Venture Capital, and OMERS Ventures.
RANOVUS’ product platform is enabled by the company’s innovation in Quantum Dot Multi-Wavelength Laser technology combined with advanced digital and photonics integrated circuit technologies.
RANOVUS will utilize the new round of financing to execute on the company’s innovative roadmap, its expansion plan to support product delivery and ramp up its leading interconnect solutions, the company said.
