TSMC to invest $14 billion in R&D at Hsinchu facility

Dollar2
Taiwan Semiconductor Manufacturing (TSMC), the world’s largest contract chipmaker, is planning a T$400 billion or $13.50 billion investment to expand its research and development capacity, Reuters reported. Read the latest telecom news

Latest

More like this
Related

MediaTek at MWC 2025: Advancing 6G and AI technologies

MediaTek will be unveiling 6G-enabling technologies, including hybrid computing,...

Apple C1 modem chip: Qualcomm to face the music?

Apple has introduced its first custom-designed modem chip --...

How MediaTek’s AI strategy fueled 22.4% revenue surge

MediaTek has revealed that its strategic focus on AI...

Qualcomm achieves growth of 13% in Handsets, 61% in Automotive, 36% in IoT

Qualcomm has posted a significant 17 percent rise in...