MediaTek has launched the MediaTek Helio P10, a chip focused on the demand for slim form-factor smart phones.
The Helio P10 showcases a 2 GHz, True Octa-core 64-bit Cortex-A53 CPU and a 700MHz, Dual-core 64-bit Mali-T860 GPU.
MediaTek said that the Helio P10 will be available Q3 2015 and is expected to be in consumer products in late 2015.
The P10 features high-performance modem technology; the world’s first TrueBright ISP engine for ultra-sensitive RWWB; and, MiraVision 2.0, for top-tier display experiences.
The other features include WorldMode LTE Cat-6, supporting 2×20 carrier aggregation with 300/50Mbps data speed; task scheduling algorithm, CorePilot, which optimizes the P10’s heterogeneous computing architecture.
“The P series will provide OEM smartphone makers with greater design flexibility to meet consumer demands for slim form-factors, which provide dynamic multimedia experiences,” said Jeffrey Ju, senior vice president of MediaTek.
MediaTek claims that the Helio P10 is the first product to use TSMC’s 28nm HPC+ process, which allows for reduced processor power consumption. Helio P10 can save up to 30 percent more power compared to existing smartphone SoCs manufactured using the 28 HPC process.
BJ Woo, vice president, Business Development, TSMC, said: “As an enhanced version of TSMC’s 28HPC process, 28HPC+ promises 15 percent better speed at fixed power or 50 percent leakage reduction at the same speed over 28HPC.”
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