The share of In-Cell solutions in the smartphone market is forecast to reach 27.1 percent in 2018 against 26.2 percent in 2017, according to WitsView, a division of TrendForce.
This is due to the adoption by Android smartphones. Apple’s decision against using In-Cell solutions in the new iPhones which will hit the stand on September 12 will not hit the In-Cell solutions market.
The share of TDDI (Touch with Display Driver Integration) In-Cell solutions is likely to grow to 17.3 percent, although the IC products for TDDI In-Cell products experience a tight supply.
“Branded smartphone vendors are now more willing to adopt TDDI In-Cell solutions, thanks to the maturation of IC products for TDDI and more IC suppliers’ entrance into the market,” said Boyce Fan, research director of WitsView.
Smartphone vendors have searched for alternatives from second-tier IC manufacturers or foundries, or switched to Out-Cell design despite the tight supply of wafer in the first half of 2018.
Though the new iPhone models will adopt Out-Cell solutions, the share of TDDI In-Cell solutions is likely to grow to 17.3 percent from 8.9 percent last year driven by the promotion of IC manufacturers and panel makers.
Adoption of Dual Gate in HD+ products and MUX6 in FHD+ products is aimed to narrow the border at the side of IC Bonding. IC design houses are exploring new capacity of wafer supply and may also consider the transition into more advanced processes, smaller IC sizes and new specs.
The share of TDDI In-Cell solutions in the global smartphone market would continue to grow to 24.3 percent in 2019.
