A magnitude 6.4 earthquake struck southern Taiwan at 12:17 AM on January 21, 2025, with its epicenter in Chiayi.
TrendForce’s preliminary assessment reported no significant damage to nearby wafer fabs. TSMC and UMC’s Tainan fabs experienced seismic intensity levels above 4, triggering personnel evacuation and equipment shutdowns.
No critical equipment damage was found, but debris was generated inside furnace equipment. Tainan, a critical hub for panel manufacturing, could face disruptions, intensifying the tight TV panel supply in 1Q25.
TSMC operates an 8-inch fab and two 12-inch fabs in Tainan, producing technologies from mature nodes to advanced 5/4nm and 3nm processes. UMC manages a 12-inch fab supporting nodes from 90nm to 14nm.
Operations resumed on January 21, with the earthquake’s production impact deemed controllable. The mature process utilization rate is at 70–80 percent due to seasonal demand lulls, offering flexibility for adjustments. For advanced nodes, wafer starts for inventory preparation ensure that downtime and minor debris impact are manageable, minimizing disruption risks.
Tainan hosts major display manufacturer Innolux with facilities like Fab 2, Fab 3, Fab 5, Fab 6, and Fab 7, while Kaohsiung has Fab 8, Fab 8b, and T6. Several Tainan fabs shut down equipment, with damage assessments ongoing. TrendForce warns this event could exacerbate challenges in the already constrained TV panel supply chain for 1Q25.
TelecomLead.com News Desk
