Intel and United Microelectronics Corporation (UMC) have announced a partnership to develop a 12-nanometer semiconductor process platform.
The partnership aims to cater to markets such as mobile, communication infrastructure, and networking. This strategic alliance combines Intel’s U.S. manufacturing capacity with UMC’s mature nodes, expanding the process portfolio and providing customers with a more diversified and resilient supply chain.
Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS), noted that the collaboration with UMC is a significant step towards achieving Intel’s goal of becoming the world’s second-largest foundry by 2030.
Jason Wang, UMC co-president, expressed excitement about the collaboration, stating that the U.S.-manufactured 12 nm process with FinFET capabilities aligns with UMC’s strategy of cost-efficient capacity expansion and technology node advancement.
The 12 nm node will utilize Intel’s manufacturing capacity in the U.S., incorporating FinFET transistor design. Production will take place at Intel’s Ocotillo Technology Fabrication site in Arizona, specifically in Fabs 12, 22, and 32. Leveraging existing equipment in these fabs will minimize upfront investment requirements and optimize utilization.
Both companies plan to cooperate on design enablement, supporting the 12 nm process by integrating electronic design automation and intellectual properties solutions from ecosystem partners. Production of the 12 nm process is anticipated to commence in 2027.
Intel, with over 55 years of global investment and innovation, has manufacturing sites and investments across the U.S. and internationally. IFS has seen significant progress, attracting new customers and expanding its foundry ecosystem.
UMC, with a history of over 40 years as a preferred foundry services supplier, has expanded across Asia and leads innovation in mature nodes and specialty foundry services. UMC remains a significant supplier to over 400 semiconductor customers.
