In a strategic move to bolster its semiconductor manufacturing capabilities, Continental Device India (CDIL) announced the expansion of semiconductor packaging lines in India.
Continental Device India did not reveal its investment plans for India.
This expansion is made possible through the Ministry of Electronics and Information Technology (MeitY)’s Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) in India.
With this augmentation, CDIL seeks to increase its annual capacity by a substantial 100 million units within India. The initiative commences with the first phase, featuring a surface mount packaging line that will accommodate an impressive 50 million devices.
This phase will be officially inaugurated on September 28, with Rajeev Chandrasekhar, Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship, presiding over the ceremony.
Prithvideep Singh, General Manager of CDIL Semiconductors, emphasized the company’s dedication to innovation and market diversification, asserting their readiness to meet industry demands, particularly within the power electronics, automotive, and defense sectors, both domestically and globally.
In parallel to the manufacturing expansion, CDIL has made significant strides in strengthening its testing and reliability capabilities. The company has established an advanced high reliability (HiRel) and testing laboratory in Mohali, complementing its existing NABL Accredited facility in Delhi. The HiRel laboratory stands as a pivotal asset, ensuring the qualification of CDIL’s devices for stringent sectors, including the automotive industry, defense, and aerospace.
As a global semiconductor and electronics service provider, CDIL serves a diverse customer base spanning consumer, industrial, defense, aerospace, and automotive industries. The latest expansion underscores the company’s commitment to meeting the burgeoning needs of these critical sectors and advancing its position in the global market.
