Samsung Group has unveiled detailed plans to invest 140 trillion won (approximately $90 billion) in South Korea’s central Chungcheong region, strengthening the country’s semiconductor, display, battery, and advanced materials manufacturing capabilities. The investment is part of Samsung’s broader long-term strategy to expand AI infrastructure and next-generation electronics production across South Korea.
The largest share of the investment will come from Samsung Display, which plans to invest 67 trillion won in Asan and Cheonan to expand display panel manufacturing. Meanwhile, Samsung Electronics will invest 56 trillion won to establish advanced packaging facilities for high-bandwidth memory (HBM) chips in Onyang and Cheonan, targeting the rapidly growing artificial intelligence semiconductor market.
Samsung SDI will commit 9 trillion won by 2040 in Cheonan to manufacture and develop next-generation batteries, reinforcing its position in advanced battery technologies for electric vehicles and energy storage systems. At the same time, Samsung Electro-Mechanics will invest 8 trillion won by 2040 in Sejong to produce advanced semiconductor packaging materials for AI servers while expanding domestic talent development.
The investment plans were presented by Samsung Display CEO Yi Chung during an event hosted by South Korean President Lee Jae Myung. The Chungcheong investment complements Samsung’s broader national investment strategy announced earlier this week, aimed at strengthening South Korea’s leadership in AI, semiconductor manufacturing, and advanced technology industries.
Samsung’s latest commitment comes as South Korea accelerates investments in AI infrastructure, memory chips, advanced packaging, and semiconductor ecosystems to meet rising global demand driven by generative AI applications and high-performance computing. The company’s HBM packaging expansion is expected to play a critical role in supporting next-generation AI processors and data center deployments.
