Telecom Lead America: 4G chipmaker Sequans Communications
announced that it has become a participant in Verizon’s LTE Innovation Center.
“We are very pleased to collaborate with Verizon
Wireless and to participate in Verizon’s LTE Innovation Program. The program is
a catalyst for innovation and development and we are proud to be part of this
group of leaders who have come together to help bring the world’s best wireless
technologies and products to market,” said Georges Karam, CEO of Sequans.
Verizon’s LTE Innovation Center has been established to
empower LTE innovators and promote the development of new technologies for
Verizon’s 4G LTE network.
Sequans is a provider the development of LTE semiconductor
solutions and has recently released its second generation of LTE chip
technology.
These new solutions by Sequens are built in 40 nm CMOS
and are compact, efficient, and powerful, delivering category 4 throughput of
up to 150 Mbps in a very small 10 x 10 mm package that includes SDRAM.
Sequans offers two LTE platforms, first is
Andromeda, optimized for the design of handsets and tablets, and second Mont
Blanc, optimized for the design of hostless USB modems, CPE and mobile routers.
Founded in 2003 to address the WiMAX market, Sequans
Communications develops and supplies LTE and WiMAX chips to wireless equipment
and device manufacturers worldwide.
The company expanded in early 2009 to address the LTE
market. Sequans is based in Paris, France with additional offices throughout
the world, including United States, United Kingdom, Israel, Hong Kong, Singapore,
Taiwan, South Korea, and China
Sequans selects S3 Group power management solution for WiMAX /
LTE system on chip
Recently, S3 Group, a global provider of mixed-signal,
analog, RF and power management semiconductor IP solutions, announced that 4G
chipmaker Sequans Communications licensed its power management IP.
S3 Group designed a customized power management solution
for its client using IP from its extensive portfolio.
editor@telecomlead.com
