TSMC raised $3.5 bn in bonds for new plant in U.S

Taiwanese chip firm TSMC has raised $3.5 billion in bonds for its new plant in the U.S. state of Arizona, according to a term sheet.
TSMC for iPhonesTaiwan Semiconductor Manufacturing, a major Apple supplier and the world’s largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory.

LEAVE A REPLY

Please enter your comment!
Please enter your name here

Latest

More like this
Related

Qualcomm Q1 FY2026 Results: Revenue Rises 5% as Automotive and IoT Growth Offsets Smartphone Pressure

Qualcomm has reported revenue of $12.25 billion for its...

Snapdragon 8 Gen 5 Redefines Smartphone Performance with AI and Flagship Speed

Qualcomm Technologies has unveiled the Snapdragon 8 Gen 5...

Qualcomm Reports $44.3 bn Revenue in Fiscal 2025, Driven by AI, Automotive, and IoT Growth

Qualcomm has announced results for its fiscal fourth quarter...

MediaTek Unveils Dimensity 9500 Chipset and AI Vision in Collaboration with TSMC at IMC 2025

MediaTek, a semiconductor company powering over two billion devices...