STMicroelectronics ships 100 millionth chipset for STB in India

STMicroelectronics on Wednesday said it has shipped its 100 millionth chipset for digital cable and satellite set-top boxes (STB) in India — at Convergence India 2016.

“This key milestone highlights ST’s engagement in India and the competitiveness of our SoC portfolio that has been recently expanded with a new generation HD and Ultra-HD devices,” said Ted Grauch, vice president Global Marketing, Consumer Product Division, STMicroelectronics.

During Convergence India 2016, ST is demonstrating its latest STB products for HD (Liege3 SoCs) and Ultra-HD (Cannes/Monaco 4K SoC) markets.

Announced at IBC 2015, ST’s HD HEVC Liege3 chipsets deliver up to five times the performance compared with previous HD SoC generations and range from entry-level 3K DMIPS up to 6K DMIPS with embedded GPU.

The Liege3 SoC family is composed of satellite variants (STiH337/STiH332), cable-market products (STiH372), and IPTV set-top-box devices (STiH307/STiH302).

The STiH337/STiH332 SoCs implement a new DVB-S2X demodulation scheme enabling service operators to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity.

editor@telecomlead.com

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