Micron Technology is distributing samples of its latest mobile storage solution, the Universal Flash Storage (UFS) 4.0, which utilizes their advanced 232-layer 3D NAND technology.
This cutting-edge storage solution, available in capacities up to 1 terabyte (TB), is being sent to select smartphone manufacturers and chipset vendors worldwide.
Micron’s UFS 4.0 storage surpasses competitors in essential NAND benchmarks, providing the fastest performance in the industry for flagship smartphones. Users can expect swift bootup, quick app launches, and speedy video downloads.
This groundbreaking product from Micron is their first mobile solution built on the revolutionary 232-layer triple-level cell (TLC) NAND, delivering a remarkable 100 percent increase in write bandwidth and a significant 75 percent increase in read bandwidth.
By stacking the NAND bit cell array into more layers, Micron’s 232-layer 3D NAND architecture achieves higher density, enhanced performance, and increased capacity growth per square millimeter of silicon.
This exceptional mobile solution introduces the world’s first UFS 4.0 storage to incorporate the six-plane NAND architecture, enabling substantially higher random read throughput. As a result, users experience improved responsiveness, faster application loading times, and an overall superior user experience.
Micron’s UFS 4.0 solution boasts an impressive sequential read speed of up to 4300 megabytes per second (MBps) and a sequential write speed of 4000 MBps, offering twice the performance of previous generations. This means users can enjoy faster launches of their favorite social media apps.
The UFS 4.0 solution from Micron is 25 percent more power-efficient, allowing users to engage with data-intensive apps for longer periods without the need for frequent charging. With a remarkable 10 percent improvement in write latency over competitors, app performance is exceptionally responsive.
Thanks to Micron’s UFS 4.0 solution, users can effortlessly download two hours of 4K streaming content in under 15 seconds, twice as fast as the previous generation.
Micron is shipping samples of the UFS 4.0 storage solution to mobile manufacturers and chipset vendors, offering capacities of 256 gigabytes (GB), 512GB, and 1TB. High-volume production of the UFS 4.0 storage solution is scheduled to commence in the second half of 2023.
