Japan’s Kyocera Corp plans to invest 1.3 trillion yen or $9.77 billion for manufacturing facilities and development of semiconductor-related products over three years starting in the 2023-24 business year, the Nikkei daily reported.
Kyocera is looking to borrow up to 1 trillion yen, using its 15 percent stake in KDDI Corp as collateral to fund the expansion for parts such as ceramics for chip-making equipment, Kyocera president Hideo Tanimoto said.
Kyocera earlier said it is planning capital expenditures of 200 billion yen in fiscal March 2023 as against 151.77 billion yen for fiscal ended March 31, 2022.
Kyocera to invest $9.7 bn in semiconductor business
More like thisRelated
Qualcomm Launches Snapdragon START Program to Accelerate AI Smart Glasses and Personal AI Device Development
Qualcomm Technologies has unveiled the Snapdragon Scalable Turnkey AI-Ready...
Qualcomm Unveils Snapdragon Reality Elite Platform with 48 TOPS AI and 60 percent Faster Graphics for XR Devices
Qualcomm Technologies has introduced the Snapdragon Reality Elite Platform,...
Broadcom and Samsung intro broadband-optimized reference platform for FWA market
Broadcom and Samsung Electronics have introduced a new broadband-optimized...
Broadcom Expands Wi-Fi 8 Portfolio With BCM6772, BCM6774 and BCM6776 SoCs for Multi-Gigabit Home Networks
Broadcom has expanded its Wi-Fi 8 portfolio with the...