Infineon to build $1.9 billion chip plant in Austria

Infineon chipsetGermany’s Infineon Technologies is planning to build a $1.9 billion chip facility in Austria, Reuters reported. Read the latest telecom news

LEAVE A REPLY

Please enter your comment!
Please enter your name here

Latest

More like this
Related

Qualcomm Launches Snapdragon START Program to Accelerate AI Smart Glasses and Personal AI Device Development

Qualcomm Technologies has unveiled the Snapdragon Scalable Turnkey AI-Ready...

Qualcomm Unveils Snapdragon Reality Elite Platform with 48 TOPS AI and 60 percent Faster Graphics for XR Devices

Qualcomm Technologies has introduced the Snapdragon Reality Elite Platform,...

Broadcom and Samsung intro broadband-optimized reference platform for FWA market

Broadcom and Samsung Electronics have introduced a new broadband-optimized...

Broadcom Expands Wi-Fi 8 Portfolio With BCM6772, BCM6774 and BCM6776 SoCs for Multi-Gigabit Home Networks

Broadcom has expanded its Wi-Fi 8 portfolio with the...