By Telecom Lead Team: Samsung Electronics, a provider of semiconductor technology
solutions, announced that it started producing embedded multi-chip package
(eMCP) memory for use in the rapidly expanding market segment for entry- to
mid-level smartphones.
Samsung’s new eMCP solutions come in
a wide range of densities, utilizing LPDDR2 (low power double-data-rate 2) DRAM
made with 30 nanometer (nm) class process technology and NAND flash memory
using 20nm-class technology.
As the need is growing for
more advanced software and increased data storage in smartphones and tablets,
mobile device makers are expected to introduce embedded memory solutions
throughout 2012 that offer higher performance and density. Samsung will further
accelerate growth in the mobile device market as it extends the advanced memory
segment by providing a more expansive line-up of eMCP solutions in 2012,” said
Myungho Kim, vice president of memory marketing, Device Solutions, Samsung Electronics.
The new eMCP memory solutions will
help entry- to mid-level smartphones deliver enhanced performance and longer
battery life.
The 30nm-class LPDDR2 DRAM chip in
the new eMCPs enhances the performance of entry- to mid-level smartphones with
a data transmission speed of 1,066 megabits per second (Mbps).
In comparison to a 40nm-class LPDDR2
DRAM, the new 30nm-class LPDDR2 DRAM increases performance by approximately 30
percent, and it consumes 25 percent less power.
Samsung’s embedded MCP solutions are
fabricated in packages that consist of a four gigabyte (GB) e-MMC (Embedded
MultiMediaCard) based on 20nm-class NAND flash memory for data storage, and a
choice of 256 megabytes (MB), 512MBs or 768MBs of 30nm-class LPDDR2 DRAM for
supporting high-performance mobile device systems.
Samsung Group has recently announced that it is increasing its 2012 investment
to $41.4 billion. Samsung will be banking on logic chips and OLED
displays. The group will add 26,000 employees this year, up from last year’s
25,000. Samsung now employs around 350,000 in total.
editor@telecomlead.com
