GlobalFoundries and chipset major Qualcomm announced that they are more than doubling their existing semiconductor manufacturing agreement.
Qualcomm announced today’s announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility, in Malta, New York.
GF has been manufacturing Qualcomm Technologies’ chips for many years, reaching across its global footprint. In 2021, Qualcomm’s agreement covering multiple geographies and technologies secured 22FDX capacity at GF’s Dresden facility and will now include capacity at GF’s recently announced facility in Crolles, France.
Qualcomm has also secured capacity in GF’s market leading 8SW radio-frequency silicon-on-insulator (RFSOI) technologies for Sub 6GHz 5G front-end module (FEM) which will be primarily manufactured in GF’s Singapore facilities, where site expansion plans are well underway with full ramp expected in early 2023.
Today’s announcement specifically extends Qualcomm’s U.S. based collaboration with GF in FinFET for 5G transceivers, Wi-Fi, Automotive and IoT connectivity. GF’s FinFET platforms provide a combination of performance, power and area that are well-suited for high-end Mobile, Automotive and IoT applications.
“With accelerating demand for 5G, Automotive and IoT applications, a robust supply chain is critical for ensuring innovation in these areas remains uninterrupted,” said Roawen Chen, Senior Vice President and Chief Supply Chain and Operations Officer, Qualcomm Technologies.
“Our collaboration with Qualcomm delivers innovation in mobile and IoT spanning three continents, and this agreement extension provides Qualcomm with additional U.S. based manufacturing for a more resilient supply chain,” Thomas Caulfield, president and CEO, GF, said.
