By
Telecom Lead Team: Mindspeed Technologies in collaboration
with Hong Kong Applied Science and Technology Research
Institute (ASTRI) demonstrated a first commercial-grade, production-ready
time division long-term evolution (TD-LTE) small cell reference design
at Mobile World Congress Barcelona, Spain.
Mindspeed said that it is the only small cell System-on-Chip (SoC) supplier to
demonstrate solutions for both TD-LTE and LTE FDD.
The company also supports dual-mode concurrent operation
with 3G high-speed packet access (HSPA+) and including time division
synchronous code division multiple access (TD-SCDMA).
This has been a very productive collaboration and we are
delighted that Mindspeed has been able to make the LTE small cell system generally
available to its customers. TD-LTE is important not just to the Chinese market,
but globally, and we look forward to working together on future products,” said
Dr. Cheung Nim-Kwan, chief executive officer of ASTRI.
The USB modem used for the demonstration was jointly
designed by ASTRI and Innofidei, an integrated circuit (IC) design company
in China.
Unlike reference designs that use ‘example code’ or ‘demo-ware,’ this is a fully tested, verified and deployable carrier-class
TD-LTE baseband system,” said Dr. Naser Adas, vice president and general
manager, wireless and customer premises equipment (CPE), at Mindspeed.
Picochip, which Mindspeed recently acquired, and ASTRI
began their close collaboration on the LTE femtocell reference design in the middle
of 2008, supporting both LTE frequency division duplexing (FDD) and TD-LTE.
The two companies demonstrated the world’s first TD-LTE
femtocell prototype first at Mobile World Congress 2009, and have been working
on a combined design supporting both LTE FDD and TD-LTE over the last several
years.
Please
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