Altair Semiconductor, a developer of
ultra-low power, small footprint and high performance 4G LTE chipsets, and
AsiaTelco Technologies, a supplier of wireless terminal products, announced
that Altair’s chipset has been integrated in AsiaTelco’s TD-LTE Mobile Hotspot
product, the ALM-F190.
The ALM-F190 made its debut at the ITU’s
Telecom World Geneva 2011 Conference, where it was demonstrated by China
Mobile.
“The selection of Altair’s LTE chipset
for this product has enabled us to develop a compact and low power device,
while benefitting from the high level of maturity and field testing encompassed
in its software,” said Jason Ding, CEO of AsiaTelco.
ALM-F190 is the first Mobile Hotspot
product designed for both TD-LTE and FDD-LTE, capable of delivering 100Mbps
downlink and 50Mbps uplink. The product enables users to experience
applications such as HD video streaming, online gaming and high speed Internet
browsing using multiple connected WiFi devices over a single 4G LTE connection.
“AsiaTelco’s choice of Altair chipsets
for this innovative product attests to the low power and high performance
merits of the chipset, as well as the maturity of our software,” said Eran
Eshed, co-founder and VP of Marketing and Business Development at Altair Semiconductor.
AsiaTelco supplies 4G products, including
LTE USB dongles, wireless data modules and indoor and outdoor CPEs, covering
several frequency bands. The China-based manufacturer has shipped products to
more than 30 countries around the world.
By Telecomlead.com Team
editor@telecomlead.com
