Nokia Siemens and Qualcomm to showcase HSPA+ Multiflow that doubles data speed

By Telecom Lead Team: Nokia Siemens Networks and Qualcomm
will showcase HSPA+ Multiflow that allows devices located close to the edge of
a mobile base station cell to connect with a second base station serving a
neighboring cell.

 

HSPA+ Multiflow enables operators to offer enhanced
mobile broadband with the new feature. The feature makes far more efficient use
of network resources, delivering up to double the data speed and up to 50
percent faster response compared to existing HSPA+ networks.

 

With 100 million smart devices being added every month,
we see a consequent increase in smart applications that make use of their
advanced capabilities. Not only is network traffic rising dramatically, much of
it is also unpredictable in nature, and this can impact user experience,” said
Keith Sutton, head of the WCDMA business line for Nokia Siemens Networks.

 

HSPA+ Multiflow enables simultaneous transmission of two
data streams from base stations in two adjacent cells to a single user device
instead of one data stream from one base station as is the case with HSPA+
today. Overall, this can up to double data speeds for users at cell edge. Due
to Nokia Siemens Networks’ Single RAN equipment, operators can protect their
earlier network investments, by evolving their existing HSPA networks to the
new technology with a simple software upgrade.

 

We are working with Nokia Siemens Networks to drive the
evolution and deployment of technologies like HSPA+,” said Serge Willenegger,
vice president of product management at Qualcomm. 

 

This demonstration confirms that HSPA+ Multiflow will
enable us to further enhance the HSPA+ mobile broadband user experience, and is
thus a valuable contribution toward enhancing the HSPA+ value proposition and
further expanding global mobile broadband coverage.

 

The HSPA+ Multiflow feature is expected to be 3GPP
standardized by mid 2012, and will be available commercially from Nokia Siemens
Networks by second half of 2013.

 

editor@telecomlead.com

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