The US-based semiconductor giant Qualcomm introduced New Snapdragon 600 and 400-Tier processors – promising better mobile experience and improved connectivity for smartphones.
The company said Qualcomm TruSignal Antenna boost technology and support for dual camera are now available in 600 and 400 Tier Snapdragon processors.
The new Snapdragon 653, Snapdragon 626 and Snapdragon 427 processors will deliver better processing performance than their predecessors. All three new processors will support Qualcomm Quick Charge 3.0 technology in order to deliver power up to 4X faster compared to traditional charging methods.
The technology company has extended support for dual camera from Snapdragon 800 tier to Snapdragon 600 and 400 tiers, for clear imaging and photos.
X9 LTE, with Cat 7 downlink speeds up to 300Mbps, and Cat 13 uplink speeds up to 150Mbps, designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
# LTE Advanced Carrier Aggregation with up to 2×20 MHz in the downlink and uplink
# Support for 64-QAM in the uplink
# Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.
These advanced modem capabilities can increase network capacity and improve throughputs for all users in the network.
Qualcomm Technologies announced that, over the past 12 months, there have been more than 400 OEM designs based on our Snapdragon 600-tier chipsets, including more than 300 devices launched and more than 100 device designs currently in the pipeline.
Snapdragon 600 and Snapdragon 400 Features:
Snapdragon 653 processor features an increase in CPU and GPU performance over the Snapdragon 652 and doubles the addressable memory (RAM) from 4GB to 8GB supporting greatly enhanced user experiences. The Snapdragon 653 is pin and software compatible with Snapdragon 650 and 652.
The Snapdragon 626 features a CPU performance increase over the Snapdragon 625. It features Qualcomm TruSignal antenna boost, designed to improve signal reception in congested areas. The Snapdragon 626 is pin and software compatible with Snapdragon 625, and software compatible with the Snapdragon 425, 427, 430, and 435 processors.
The Snapdragon 427 delivers a CPU and GPU performance increase over the Snapdragon 425. The company said it is the first chipset to bring TruSignal to the Snapdragon 400 tier of processors, designed to deliver powerful antenna tuning to this high volume line of processor solutions. Snapdragon 427 is pin and software compatible with Snapdragon 425, 430 and 435, and software compatible with Snapdragon 625 and 626.
Snapdragon 653 and 626 chipsets are expected to be commercially available by the end of 2016. Snapdragon 427 chipset is expected to be in commercial devices in early 2017.
editor@telecomlead.com