MediaTek is presenting its “AI For Life: From Edge to Cloud” showcase, highlighting silicon innovations spanning 6G communications, 5G-Advanced CPE with Wi-Fi 8, AI-powered smartphones, automotive connectivity and advanced data center technologies.
The showcase at the Mobile World Congress (MWC 2026) in Barcelona — reflects MediaTek’s strategy to build intelligent, seamlessly connected ecosystems powered by AI across edge, network and cloud environments.
The keynote session, led by President Joe Chen in Hall 8, outlines MediaTek’s collaborative efforts with ecosystem partners to accelerate progress in mobile, automotive and AI-driven innovation.
6G Leadership and AI-Driven Connectivity
A central focus of MediaTek’s MWC 2026 presence is its advancement in 6G research and standards development. The company is demonstrating the world’s first 6G radio interoperability, designed to flexibly balance throughput, latency and power efficiency while supporting emerging generative and agentic AI services.
MediaTek is also introducing AI-accelerated uplink transmit diversity for 6G. The solution dynamically adapts to network conditions using AI learning models, significantly enhancing performance compared to traditional rule-based optimization techniques.
Another key concept is the “personal device cloud,” where AI agents collaborate seamlessly across household and personal devices over Wi-Fi or 6G networks within a secure computing environment. The company is also highlighting how 6G-enabled edge computing will power next-generation robotics by delivering compute-intensive workloads with ultra-low latency.
5G-Advanced CPE with Wi-Fi 8
MediaTek is unveiling what it describes as the world’s first 5G-Advanced CPE device integrated with Wi-Fi 8. Powered by the MediaTek T930 modem and Filogic 8000 series chipsets, the solution supports the latest 3GPP Release 18 standard.
The CPE introduces eight receive antennas that improve spectrum efficiency by more than 40 percent and three transmit antennas with five MIMO layers to increase uplink throughput by 40 percent. Its AI network engine integrates AI L4S and AI QoS technologies to reduce latency by up to 10 times across both L4S-capable and legacy applications, without requiring backend infrastructure changes.
Automotive Connectivity and Intelligent Cockpits
MediaTek is demonstrating the world’s first 5G NR NTN video call for automotive applications, enabling satellite-based connectivity beyond terrestrial network coverage. This breakthrough allows high-speed satellite communications for video streaming and connected car services.
The company is also introducing a new telematics chipset supporting 5G-Advanced Release 17 and Release 18 standards, featuring integrated modem-level AI to enhance connection stability.
For in-vehicle experiences, MediaTek is showcasing a new Dimensity Auto smart cockpit platform built on a 3-nanometer automotive-grade process. The platform includes a high-performance Arm v9.2-based CPU, advanced GPU capabilities supporting ray tracing for console-level gaming, and a powerful NPU enabling generative AI voice assistants with enhanced data privacy.
AI-Powered Mobile and Wearable Innovation
MediaTek continues to expand its smartphone leadership with the Dimensity 9500 flagship mobile platform. Equipped with an advanced NPU, the chipset enables secure and responsive on-device AI processing for next-generation mobile experiences.
The company is also unveiling AI glasses powered by Dimensity 9500, supporting multimodal AI interaction through text, image, speech and video. The wearable device enables real-time, privacy-focused AI collaboration with smartphones using on-device processing.
Data Center Performance and UCIe-Advanced IP
In the data center domain, MediaTek is introducing a newly developed in-house UCIe-Advanced IP for die-to-die connectivity. Silicon-validated on TSMC 2-nanometer and 3-nanometer process technologies, the solution supports advanced packaging methods and delivers bandwidth densities of up to 10 terabits per second per millimeter of die edge with ultra-low power consumption.
MediaTek is also presenting its co-packaged optics solution, designed to overcome copper interconnect limitations. The technology enables bandwidth speeds of up to 400 gigabits per second per fiber while improving system energy efficiency and integration.
These advancements are designed to maximize performance per watt and total cost of ownership in data centers. Rather than focusing solely on raw processing power, MediaTek emphasizes tokens per watt and tokens per dollar at the rack level to ensure optimized AI workload efficiency.
Expanding AI Across IoT and High-Performance Compute At its MWC booth, MediaTek is showcasing high-performance compute capabilities on the NVIDIA DGX Spark featuring the NVIDIA GB10 Grace Blackwell Superchip co-designed with NVIDIA. The company is also demonstrating IoT innovations, including an AI interpreter hub, and highlighting on-device AI capabilities for Chromebook devices powered by the MediaTek Kompanio Ultra platform.