MediaTek has introduced its latest flagship and premium mobile chipsets, the Dimensity 9500s and Dimensity 8500, at MediaTek Tech Day in Delhi. The new processors are designed to deliver major advances in performance, energy efficiency, agentic AI, imaging, gaming and wireless connectivity for next-generation smartphones. The launch event brought together media, analysts and OEM partners, with OPPO India and POCO India confirming upcoming smartphones powered by the new platforms.
JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit, said the company is increasing investments in advanced technologies to make flagship-level experiences accessible to more users. The new Dimensity chipsets reflect this vision by combining cutting-edge performance with improved power efficiency.
Dimensity 9500s targets ultimate flagship performance
Built on a 3nm process, the MediaTek Dimensity 9500s uses an All-Big Core CPU architecture to deliver higher performance and better energy efficiency. The octa-core design includes:
- One Cortex-X925 ultra core up to 3.73 GHz
- Three Cortex-X4 premium cores
- Four Cortex-A720 performance cores
The chipset integrates the Immortalis-G925 GPU, enabling immersive mobile gaming with advanced ray tracing. Its powerful NPU is optimized for generative reasoning and multi-modal AI models, enabling advanced camera features and content creation capabilities directly on devices.
Key features of Dimensity 9500s include:
- 8K full-focus Dolby Vision HDR recording with real-time 30fps motion tracking via MediaTek Imagiq ISP
- MediaTek Adaptive Game Technology 3.0 and Frame Rate Converter 3.0 to improve power efficiency and battery life
- 5G Release-17 modem with 4CC carrier aggregation and up to 7Gbps downlink speeds
- MediaTek 5G UltraSave 4.0 power saving technology
- AI Network Suite 2.0 to improve performance in weak connectivity environments
- MediaTek Xtra Range 3.0 to extend indoor Wi-Fi coverage and enable Bluetooth phone-to-phone connections up to 5 kilometres
Dimensity 8500 brings flagship features to premium segment
MediaTek also introduced the Dimensity 8500, built on an energy-efficient 4nm process and designed to deliver strong performance for premium smartphones. The chipset features an All-Big Core CPU with eight Cortex-A725 cores clocked up to 3.4 GHz, combined with LPDDR5X memory support at 9600 Mbps for faster multitasking and improved battery life.
The Dimensity 8500 focuses heavily on gaming and AI experiences. Its upgraded computing core and gaming engine deliver full-frame stabilization, faster loading and improved energy efficiency. Ray tracing support also expands to mainstream mobile games for more realistic visuals.
Key features of Dimensity 8500 include:
- 8th-generation MediaTek NPU supporting leading large language models and image generation models
- Mali-G720 GPU with 25 percent performance improvement over the previous generation
- AI ultra-clear telephoto algorithm for improved zoom photography
- Dimensity AI semantic engine for intelligent image optimization
AI and flagship experiences for a wider audience
Anuj Sidharth, Director of Marketing and Corporate Communication at MediaTek India and SEA, said the new chipsets aim to democratize flagship smartphone experiences by combining All-Big Core architectures, agentic AI and advanced imaging.
OPPO and POCO also confirmed upcoming devices powered by the new platform. OPPO announced plans to bring the Find X9s to India as part of its flagship ecosystem powered by Dimensity 9500s. POCO said it will launch a new performance-focused smartphone using the chipset to deliver next-generation mobile experiences.
BABURAJAN KIZHAKEDATH