MediaTek has unveiled its latest innovation, the Dimensity 8450 5G chipset, at the MediaTek India Dimensity Summit, delivering a leap in mobile performance, energy efficiency, and intelligent user experiences.
Dimensity 8450 5G chipset is designed for next-generation smartphones. The premium SoC empowers customers with cutting-edge capabilities in AI, imaging, gaming, and connectivity — marking a significant step forward in MediaTek’s strategy to make high-performance mobile computing more accessible.
At the heart of the Dimensity 8450 is MediaTek’s All Big Core design, featuring eight high-performance Arm Cortex-A725 cores and the Arm Mali-G720 MC7 GPU. This architecture ensures seamless multitasking, enhanced gaming frame rates, and reduced power consumption — benefitting users who demand speed and efficiency in every task.
To enrich user creativity and productivity, the MediaTek Dimensity Agentic AI Engine (DAE) harnesses generative AI capabilities to support large and small language models, image enhancement, and on-device reasoning. Its NPU 880 enables flagship-level AI imaging, including real-time photo enhancements and advanced AI camera features, giving users the tools to create professional-grade content on the go.
Customers also gain immersive gaming experiences, with the Dimensity 8450 delivering industry-best FPS and optimized power usage for graphically demanding titles like PUBG90 and Genshin Impact. Its multi-frame EIS engine and 4K60 HDR video capture unlock studio-quality video with exceptional stabilization — perfect for content creators and vloggers.
The chip also includes 5G-A modem technology with support for up to 3CC-CA and peak download speeds of 5.17Gbps, making it ideal for streaming, cloud gaming, and high-speed downloads. Support for WQHD+ 144Hz displays and dual screen setups elevates the mobile entertainment and multitasking experience.
The India Summit celebrated the one-year anniversary of MediaTek Connect, a community of tech enthusiasts, through hands-on demos and a gaming tournament, highlighting real-world applications of the Dimensity series. The event featured participation from key OEM partners — OPPO, Vivo, Realme, Motorola, Redmi, Infinix, Tecno, Lava, and Samsung — who showcased their latest smartphones powered by various Dimensity chipsets.
MediaTek’s strategic focus on an inclusive 5G ecosystem is further reflected in its diversified chipset lineup across the flagship (Dimensity 9000), premium (8000), upper midrange (7000), and entry-level (6000) segments. The Dimensity 8450 builds on this vision by offering a robust option for OEMs seeking high-end performance without compromise.
With OPPO set to launch the Reno14 Pro and a new K-series smartphone powered by the Dimensity 8450, MediaTek is reinforcing its position as a driving force behind innovative, AI-enabled, and consumer-focused 5G smartphones globally.
TelecomLead.com News Desk