Chipmaker SK Hynix may cut Capex to $12 bn July 15, 2022 South Korean chipmaker SK Hynix is considering cutting its 2023 capital expenditure by about a quarter to 16 trillion won ($12.16 billion), Bloomberg News report said. SK Hynix’s move is in response to slower-than-anticipated electronics demand. Editorhttps://telecomlead.com TagschipssemiconductorSK Hynix Share Copy URLLinkedinXFacebookEmail LEAVE A REPLY Comment: Please enter your comment! Name:* Please enter your name here Email:* You have entered an incorrect email address! Please enter your email address here Website: Save my name, email, and website in this browser for the next time I comment. Previous articleTSMC raises 2022 revenue growth forecastNext articleXiaomi India announces appointment of Muralikrishnan as President Latest Verizon to Sell 274 Retail Stores and Cut 500 Corporate Jobs, Impacting 3,000 Employees TRAI Drive Test: Reliance Jio Leads Mobile Network Performance in Uttara Kannada, Airtel Excels in Upload Speeds, BSNL Falls Behind TRAI Drive Test: Reliance Jio Leads Mobile Network Performance in Kasaragod, Airtel Delivers Strong Voice Quality, BSNL Trails TRAI Drive Test: Reliance Jio Tops Mobile Network Performance in Sindhudurg, Airtel Follows, BSNL Lags TSMC Q2 2026 Profit Soars 77% to Record T$706.6 bn as AI Chip Demand Drives Growth and Capex Rises realme C100x 4G Launched in India with 8000mAh Battery, 45W Fast Charging, 120Hz Display; Price Starts at INR 14,499 Gartner Names NVIDIA, AMD, Broadcom, Marvell and Infineon as Companies to Beat in AI Semiconductor Market Tele2 Cuts Capex 26 Percent in Q2 2026 While Accelerating 5G, Spectrum and Sovereign Cloud Investments Tele2 Q2 2026 Revenue Rises to SEK 7.39 bn as ARPU Growth, Cost Discipline, AI and Digital Investments Drive Performance Telenor Q2 2026 Capex Rises 3.7 Percent as AI Factory, 5G Networks and IT Transformation Drive Investments More like thisRelated Qualcomm Launches Snapdragon START Program to Accelerate AI Smart Glasses and Personal AI Device Development Editor - June 16, 2026 Qualcomm Technologies has unveiled the Snapdragon Scalable Turnkey AI-Ready... Qualcomm Unveils Snapdragon Reality Elite Platform with 48 TOPS AI and 60 percent Faster Graphics for XR Devices Editor - June 16, 2026 Qualcomm Technologies has introduced the Snapdragon Reality Elite Platform,... Broadcom and Samsung intro broadband-optimized reference platform for FWA market Editor - May 27, 2026 Broadcom and Samsung Electronics have introduced a new broadband-optimized... Broadcom Expands Wi-Fi 8 Portfolio With BCM6772, BCM6774 and BCM6776 SoCs for Multi-Gigabit Home Networks Editor - May 27, 2026 Broadcom has expanded its Wi-Fi 8 portfolio with the...