The U.S. Commerce Department has finalized awards to Samsung Electronics, Texas Instruments and Amkor Technology to boost semiconductor production and packaging facilities in the United States as part of the $39 billion subsidy program to strengthen the domestic chip industry.
Key recipients include:
Samsung Electronics will receive up to $4.745 billion, down from $6.4 billion initially proposed.
Samsung Electronics will be making an investment: $37 billion to build two chip production facilities, a research center, and a packaging facility in Texas by 2030. The smaller award reflects revised market conditions and scaled-back investment plans.
Texas Instruments will receive up to $1.61 billion — $900 million for Texas operations and $700 million for Utah.
Texas Instruments is making an investment of over $18 billion to construct two new factories in Texas and one in Utah by 2029, creating 2,000 manufacturing jobs.
Amkor Technology will receive up to $407 million.
Amkor Technology is making an investment of $2 billion in an advanced semiconductor packaging facility in Arizona, the U.S. Amkor Technology’s main customer is Apple. Chips will be sourced from a nearby TSMC facility.
These awards are part of the multi-billion initiative to establish a robust domestic semiconductor supply chain, supported by government incentives and private investments.