Samsung Electronics, headquartered in South Korea, has unveiled plans to inject approximately 40 billion yen ($280 million) into a chip packaging research facility in Japan. The city of Yokohama disclosed this development, underlining Samsung’s commitment to advancing chip technologies on foreign soil.
Samsung’s substantial investment arrives against a backdrop of relaxed tensions between South Korea and Japan. With the United States advocating for closer collaboration among allies to counter China’s surging technological dominance, this move reflects a strategic alignment of interests.
The chip giant commenced reinforcing its advanced chip packaging division the previous year. In a race to innovate, companies are fervently pursuing advancements in packaging techniques, recognizing the potential to heighten chip performance by integrating components within a singular package.
Kyung Kye-hyun, head of Samsung’s chip business, highlighted that the establishment of the Japanese facility will not only augment Samsung’s influence in the chip sector but also facilitate partnerships with packaging-focused enterprises situated in Yokohama. This revelation came forth within the announcement made by the city administration, signifying a concerted effort to forge alliances in pursuit of technological excellence.