Telecom Lead Asia-Pacific: Semiconductor major Intel
Corporation and Chinese telecom equipment maker Huawei have announced
a collaboration to advance the development of interoperability testing and
deployment of LTE TDD solutions.
Under the collaboration, both companies will establish
a joint lab based in China for IOT (Interoperability
Test) and fast implementation of LTE TDD technology.
Huawei has been committed to LTE
TDD commercial deployment worldwide. We will continuously invest in
LTE TDD research and deployment as well as the global expansion of
LTE TDD networks. We are excited to partner with Intel to
accelerate the development of our technology and provide our customers with
leading LTE TDD solutions,” said Deng Taihua, president LTE TDD &
WiMAX & TDS wireless networks, Huawei.
Huawei said that this collaboration will employ its
proficiency in LTE TDD network infrastructure technologies.
Furthermore, Intel’s cost-optimized mobile communication
platforms will also be used to accelerate the development and
deployment of LTE TDD.
“Collaborative innovation is Intel’s strategy
in China. The engagement with Huawei will take advantage of the two companies’
strengths and leading technologies. We are committed to working together with
partners in China to build a healthy LTE TDD ecosystem within China and
even beyond,” said W.K Tan, VP of Intel IAG & Head of MCG, China.
By connecting directly to Huawei’s infrastructure,
Intel will carry out end-to-end testing of its mobile platforms in a real life
environment.
At the Mobile World Congress 2012, Intel announced several industry partnerships with
Orange, Lava International, ZTE and Visa to enhance smartphone portfolio.
Huawei grabs #2 spot in wireless network market in Q4 2011 from
Nokia Siemens
Recently, Huawei overtook Nokia Siemens Networks to grab
second place in the wireless equipment market in Q4 2011. Ericsson is the
market leader, with approximately $3.5 billion in wireless network equipment
sales during fourth quarter of 2011.
editor@telecomlead.com
